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Description Product
The HJ30J Series Micro Rectangular High-Speed Connectors are designed for high-density, high-speed board-to-board interconnections in chassis and cabinet-level applications, offering excellent electrical performance and mechanical reliability in harsh environments.
Funzioni principali
- Flexible stranded pin contacts for enhanced reliability
- High-density contact layout with 1.27 mm × 1.27 mm pitch
- Metal shielding shell for superior EMI protection
- Available in 7 shell sizes: 12, 18, 24, 30, 36, 55, 100 contacts
- Ideal for high-speed signal transmission between boards
quaternu di tecnica
| paràmetru | spicifichi |
| temperature rise | -55 ° C a + 125 ° C |
| Impedenza caratteristica | 100 ± 15 Ω |
| Corrente stimata | 3 A |
| Resistenza di cuntattu | ≤ 20 mΩ |
| Tensione di resistenza dielettrica | 800 V (room temperature) |
| A resistenza di u isolamentu | ≥ 5000 MΩ (500 VDC); ≥ 100 MΩ (wet heat) |
| Velocità di trasmissione di dati | Finu à 1.65 Gbps |
| Vita meccanica | 500 cicli di accoppiamentu |
| Chjami Aghjalesi | 10–2000 Hz, 196 m/s² |
| Shock | 735 m / s² |
